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1.5g Metal OxIDE Thermal CPU Paste Compound Tube for Heatsink - cpu paste - thermal compound - thermal grease


Product Information Specifications
Features
Thermal resistance0.12 °C/W
Thermal conductivity1.93 W/m·K
Operating temperature (T-T)-30 - 180 °C
Product colourSilver
Specific gravity1.7 g/cm³
Technical details
Evaporation (@ 200°C/24h)0.001%
Bleed (@ 200°C/24h)0.05%
Sustainability certificatesRoHS
Thermal resistance0.12 °C/W
Thermal conductivity1.93 W/m·K
Operating temperature (T-T)-30 - 180 °C
Weight & dimensions
Depth67 mm
Weight10 g
Package width84 mm
Package depth151 mm
Package height25 mm
Package weight17 g
Packaging data
Package width84 mm
Package depth151 mm
Package height25 mm
Package weight17 g
Operational conditions
Operating temperature (T-T)-30 - 180 °C
Colour
Product colourSilver

Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.

A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.

Please see our support section for the Material Safety Data Sheet for SILVGREASE1.

The StarTech.com Advantage
- Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications

POA excl. VAT
Code: SILVGREASE1
UNSPSC: 32131008
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